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Cutting Corners on the Learning Curve
EmbeddedPlus to participate in IBM’s Software University 2006.
TEMPE, AZ, January 13, 2006 - EmbeddedPlus Engineering today announced their participation in the 2006 Software University event, presented by IBM at the Mirage in Las Vegas from January 15 through January 20.
Software University is an annual gathering of the IBM software sales force and Business Partners that support the IBM product line. A vast array of educational course options is available to the nearly 15,000 participants, and there are several networking events as well.
EmbeddedPlus will be exhibiting two products in the Software University Solution Village; DoorKeeper for the Rational Software Development Platform (RSDP), a tight integration between Telelogic DOORS® and Rational’s modeling tools, and the Systems Modeling and Simulation Toolkit for the RSDP, which offers support for SysML and model simulation, also based on Rational’s modeling tools.
“We’re honored to be able to attend this year’s Software University. The opportunity to meet the IBM Rational software team from all over the world is one we can’t afford to miss” says EmbeddedPlus President Paula Thetford Obeid. “We hope to learn even more about how to improve the IBM-related portfolio of our own product line” she adds.
About EmbeddedPlus Engineering
EmbeddedPlus Engineering, LLC provides products and services that transition companies to advanced technologies and techniques based on industry standards such as UML, SysML, Eclipse, DO-178B and CORBA. Other capabilities include tool integration, modeling/simulation solutions and Eclipse-based development. An official Qualified Service Provider in the Object Management Group MDA Fast Start program, EmbeddedPlus is also a partner with The Boeing Company in the Department of Defense Mentor-Protégé Program.
For more information about EmbeddedPlus Engineering, visit www.embeddedplus.com or call Media Contact Russ Seideman at 480.517.9200.