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Requirements, Change, and Configuration Management
EmbeddedPlus to support Telelogic TechConnect Customer Symposium
PHOENIX, AZ, May 4, 2005 - EmbeddedPlus Engineering today announced their participation in the Telelogic TechConnect Customer Symposium, being held today at the Phoenix Airport Marriott.
TechConnect is a half-day event designed as a forum for Telelogic customers to network and share ideas bout the use of Telelogic products. The event also provides a forum to discuss general issues surrounding requirements, change, and configuration management.
The agenda includes customer presentations describing how they use Telelogic tools, information form Telelogic staff about products and solutions, and tricks and tips for using the products.
“We always look forward to supporting our technology partners at events like this” says EmbeddedPlus Engineering President Paula Thetford Obeid. “We can get considerable insight into how to improve our products from both formal and informal discussions” she adds.
About EmbeddedPlus Engineering
EmbeddedPlus Engineering, LLC provides products and services that transition companies to advanced technologies and techniques based on industry standards such as UML, SysML, Eclipse, DO-178B and CORBA. Other capabilities include tool integration, modeling/simulation solutions and Eclipse-based development. An official Qualified Service Provider in the Object Management Group MDA Fast Start program, EmbeddedPlus is also a partner with The Boeing Company in the Department of Defense Mentor-Protégé Program.
For more information about EmbeddedPlus Engineering, visit www.embeddedplus.com or call Media Contact Russ Seideman at 480.517.9200.